03/31/2026
By Danielle Fretwell

The Francis College of Engineering, Department of Electrical and Computer Engineering, invites you to attend a Master's Thesis defense by Daniel Dunkum Bousquet on: "Additively Manufactured X-Band RF Devices: Performance and Survivability in Harsh Environments."

Candidate Name: Daniel Dunkum Bousquet
Degree: Master’s
Defense Date: Thursday, April 9, 2026
Time: Noon - 2 p.m.
Location: ETIC 445

Committee:

  • Advisor: Oshadha Ranasingha, Assistant Professor, Electrical Engineering, University of Massachusetts Lowell
  • Oshadha Ranasingha, Assistant Professor, Electrical and Computer Engineering, University of Massachusetts Lowell
  • Alkim Akyurtlu, Professor, Electrical and Computer Engineering, University of Massachusetts Lowell
  • Richard Fink, Vice President, Applied Nanotech Inc.

Abstract:
Additively Manufactured (AM) electronic devices are a relatively novel method of fabricating electronics with the potential to bypass many of the constraints which come about with traditional manufacturing. These devices are often light, highly flexible, and cost-effective in comparison to traditionally manufactured devices. This makes these devices highly sought after, especially in industries such as the space industry, which must take such things into consideration when designing electronics. However, since AM electronics is a relatively novel technology, there are many holes in the literature regarding AM devices’ responses to harsh environments. Particularly, there has been very minimal research regarding AM High Frequency RF devices. Here, we present various RF devices, comprised of various materials, both novel and commercially available, as well as an analysis of their responses to harsh environments. The devices include patch antennas, coplanar waveguides (CPWs), microstrips, and frequency selective surfaces (FSS). Additionally, there are some non-RF elements which were manufactured including thermocouples and conductive pads. The harsh environments tested largely include gamma radiation exposure, thermal vacuum cycling, high humidity exposure, and cascading exposures of the previously mentioned environments. Many of these devices remained stable throughout the various environmental exposures, showing that many of the materials used in these exposures are viable in harsh environments. This work will address the gap in the literature regarding AM electronics in harsh environments and allow more ease for future designers when choosing which materials to use in their AM electronic devices which will be used in harsh environments.