02/03/2026
By Dongming Xie
An engineering team, including UML alumni Derek Lovejoy, Samantha Cross and Robert Guyette Jr., from GreenSource Fabrication, will give a seminar entitled "Process Engineering in PCB/IC Substrate Fabrication."
Thursday, Feb. 5
3:30-4:45 p.m.
Ball Hall 210
Abstract: As a result of recent onshoring efforts, Printed Circuit Board (PCB) and Integrated Circuit Substrate (ICS) Fabrication is a fast-growing industry in the United States. At the leading edge is GreenSource Fabrication (GSF), a PCB/ICS fabricator focused on high complexity, low volume production mainly for DoD and other High-Density Interconnect (HDI) applications. The production of such high technology products is made possible by GreenSource’s highly automated factory located in Charlestown, N.H. Further, GSF was the first fully Zero Liquid Discharge (ZLD) PCB facility in the world, meaning all liquid waste from processing is treated in a state-of-the-art, in-house recycling system.
In effect, GSF sets the standard for minimizing environmental impact while simultaneously manufacturing cutting edge HDI-PCB products. Fabrication of PCBs and IC Substrates is a complicated endeavor, involving ever advancing materials, unique process flows, and a wide range of cutting-edge chemical and mechanical processes. As such, process engineers play a critical role in maintaining product quality, developing new processing methods, and ensuring smooth and efficient factory operations. This seminar looks to bring this often-overlooked engineering career path directly to university students.
Topics of discussion will include an introduction into PCB processing methods, the responsibility of process engineers, examples of industrial engineering projects, and the importance of university collaboration. As a closing note, a brief introduction to GSF’s new ISO-6 and ISO-7 clean room facility will be provided. Dubbed GSF-2, this building was designed and optimized from the ground up for IC Substrate fabrication.