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Nano Lab Clean Room

The Nanofabrication Lab Wing of the ETIC at UMass Lowell offers clean-room facilities equipped to handle complex research projects that require micro- and nanoscale fabrication.

The Nanofabrication Lab Wing offers Class 100-, Class 1,000- and Class 10,000-level clean-room facilities. It is specifically designed for research initiatives with corporate partners and has an on-site dedicated research staff for project management.

The Nano-Micro Fabrication Laboratory offers the following core equipment. We have focused our purchases largely on new equipment to promote both cutting edge technology and machine up-time. Please note this is not our complete equipment set.

Image Transfer

We have chosen two pieces of equipment to provide both micro and Nano image transfers capability.

  • The Raith 150two is an electron beam write system that can image to less than 10 nanometers. This tool can also act as a high end Scanning Electron Microscope with a rotation and tilt module. We will be able to process full wafers and pieces and inspect the work. This is one of the most versatile and reliable electron beam lithography systems on the market. It also is a standalone system with all the computer hardware necessary to generate patterns and transfer them on to samples.
  • The Suss MA/BA6 is in industry standard mask aligner that can provide sub-micron image transfer. The MA/BA6 is capable of both front and back side alignment.
  • To support the image transfer process we have purchased Brewer Science Auto Precision Coat Bake System 200BX and the Precision Develop Bake 200DX
  • In addition to give researchers  the capability to do “Lift Off” processes we have purchased a “YES-58TA Dual Function Vapor Prime and Image Reversal System”.  
  • We have commissioned a local vendor “Plastic Concepts of Billerica MA” to build us four custom wet stationsfor Acids, Bases and Solvent Stations. Plastic Concepts is providing the University with leading edge safety systems and energy efficient wet stations. We have stressed automation where ever possible to prevent accidents in the lab environment in addition to having the capability to restrict air flow to 25% when the system is not in use to save energy.


  • We have four new pieces of equipment for depositing both conductive materials and dielectrics. We have purchased a CHA 6 Pocket Electron Beam Evaporator that also has a thermal source. This system is capable of “Co-Deposition” i.e. the  capability to co-deposit two materials simultaneously using two separate evaporation sources. Each evaporation source has its own thickness monitor for independent rate control so that the ratios of the two materials can be precisely controlled. The CHA solution system is designed to do both  lift off (uni-directional) and conformal coatings.
  • The Aixtron Black Magic CNT and Graphene Deposition Tool represents the leading edge for Carbon nano tube deposition. This system can do both thermal and plasma based depositions. We will be able to deposit  mono layer graphene, vertical carbon nano tubes and well as single and double wall CNT’s. 
  • The Oxford Plasma Lab 100 PECVD tool is an industry standard for depositing Amorphous Silicon, Silicon Nitride ,Silicon Dioxide and Silicon Oxinitride. The Oxford Plasmalab 100 can also heat the substrate to 100-400 degrees Celsius. Nominal deposition thicknesses of 10nm-1000nm.  PECVD provides the researcher with the ability to provide conformal coating over topography. 
  • The Cambridge Nano Tech Fiji Atomic Layer Deposition tool give the researcher the capability to deposit a number of materials a mono–layer at a time on any number of surfaces. The Fiji can run with or without plasma and deposit conformal coating in and around structures such as Carbon Nanotubes, and other high aspect ratio structures. The FIJI can deposit on temperature sensitive devices with a plasma or as high as 300C with a thermal only process. 


The Oxford Dual Chamber Reactive Ion Etch Plasma Lab 80 Tool can be configured with many gases to etch materials such as those deposited in the PECVD tool as a sheet or around a photoresist mask. The Oxford will have one chamber dedicated to Oxygen/fluorine based etches and the other chamber dedicated Chlorine based etches.


  • The NIKON L200 with Quadracheck XYZ measurement stage 
  • The Tencor Flexus 2320 stress measurement system.
  • The Dektak XTA Surface Profilometer
  • The Filmetrix F40-UV Thin Film Measurement System