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Prof. Gu Receives 3M Faculty Award

Research to Benefit Electronics Assembly and Packaging

Zhiyong Gu

07/28/2010
By

Edwin L. Aguirre

Chemical engineering Asst. Prof. Zhiyong Gu recently received a 3M Nontenured Faculty Grant for his research project on “Multifunctional Nanowires and Nano-soldering for Electronics Assembly.”

The annual award recognizes outstanding new faculty for the quality and pertinence of his or her research and is intended to help him or her achieve tenure, remain in the teaching position and conduct basic research.

In addition to Gu, other recipients of this year’s award include faculty researchers from Harvard, University of Wisconsin-Madison, University of Minnesota, University of California, Washington University, Princeton, Cornell, Penn State, Northwestern and Columbia.

“The award comes with a grant of $15,000 per year for up to three years,” says Gu. “The award is unrestricted, and may be used by the recipient in his or her research program as needed, say, for personnel salary, student support, equipment, travel, etc.”

He and his team of grad students plan to synthesize lead-free nano-solder materials and develop nano-soldering techniques for use in electronics assembly and packaging.

“This technology will play a critical role in the emerging nanotechnology and nanomanufacturing fields, especially for the assembly and integration of nanowires for nanoelectronics and nanosensor applications,” he says. “It will also be useful for microelectronics manufacturing and the semiconductor industry.”

In June, Gu and the other awardees were invited to the 3M Science and Engineering Faculty Day event at the 3M Center in St. Paul, Minn., where they toured the Hall of Innovation and had a reception dinner.

“We participated in the faculty poster session and interacted with 3M sponsors, industrial scientists, engineers and fellow awardees,” he says.